[Links of the day] 28/10/2016 : 3D chip stacking Wireless interconnect, Golem reverse MVC framework, Data Cleaning with R

• ThruChip : The trend is to stack chips to save space and increase bandwidth. Most solution use Thru-Silican Vias (TSV) solution. Instead of using TSV, ThruChip company propose to use wireless interconnect to link the different chips and claims that they can achieve terabytes/s of bandwidth. [video] [slides]
• Golem : Golem turns the MVC app inside out by making the client the intermediary between the application servers and the database.
• Data cleaning with R : data cleaning often take more time than the analysis itself. This paper describe how to do it fast and efficiently with R.